8461.90.60/Stress Relief Wafer Grinder/Canada

Stress Relief Wafer Grinder from Canada

Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include stress measurement validation data in support docs

• Bundle with metrology tools under single entry