8461.90.60/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

High-precision diamond saw that slices monocrystalline boules into thin semiconductor wafers. Working by removing material through sawing, it matches HTS 8461.90.60 for other machine tools in wafer manufacturing per statistical note (a)(ii)(B).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document kerf loss and wire diameter specs proving semiconductor use

• Pair with boule grinder imports under same shipment for consolidated entry