Semiconductor Wafer Slicing Saw from Germany
High-precision diamond saw that slices monocrystalline boules into thin semiconductor wafers. Working by removing material through sawing, it matches HTS 8461.90.60 for other machine tools in wafer manufacturing per statistical note (a)(ii)(B).
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document kerf loss and wire diameter specs proving semiconductor use
• Pair with boule grinder imports under same shipment for consolidated entry