8461.90.60/Semiconductor Wafer Slicing Saw/Germany

Semiconductor Wafer Slicing Saw from Germany

High-precision diamond saw that slices monocrystalline boules into thin semiconductor wafers. Working by removing material through sawing, it matches HTS 8461.90.60 for other machine tools in wafer manufacturing per statistical note (a)(ii)(B).

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document kerf loss and wire diameter specs proving semiconductor use

• Pair with boule grinder imports under same shipment for consolidated entry

Semiconductor Wafer Slicing Saw from Germany — Import Duty Rate | HTS 8461.90.60