Semiconductor Wafer Slicing Saw from Canada
High-precision diamond saw that slices monocrystalline boules into thin semiconductor wafers. Working by removing material through sawing, it matches HTS 8461.90.60 for other machine tools in wafer manufacturing per statistical note (a)(ii)(B).
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document kerf loss and wire diameter specs proving semiconductor use
• Pair with boule grinder imports under same shipment for consolidated entry