Multi-Wire Wafer Saw from Mexico
Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wire count (200+) and kerf width (<50 microns) characteristics
• Consider drawback programs for export re-import scenarios