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8461.90.60/Multi-Wire Wafer Saw/Mexico

Multi-Wire Wafer Saw from Mexico

Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document wire count (200+) and kerf width (<50 microns) characteristics

• Consider drawback programs for export re-import scenarios

Multi-Wire Wafer Saw from Mexico — Import Duty Rate | HTS 8461.90.60