Multi-Wire Wafer Saw from Japan

Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Document wire count (200+) and kerf width (<50 microns) characteristics

• Consider drawback programs for export re-import scenarios