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8461.90.60/Multi-Wire Wafer Saw/Japan

Multi-Wire Wafer Saw from Japan

Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document wire count (200+) and kerf width (<50 microns) characteristics

• Consider drawback programs for export re-import scenarios

Multi-Wire Wafer Saw from Japan — Import Duty Rate | HTS 8461.90.60