8461.90.60/Multi-Wire Wafer Saw/Germany

Multi-Wire Wafer Saw from Germany

Advanced wire saw using hundreds of diamond wires simultaneously to slice silicon bricks into wafers with minimal kerf loss. HTS 8461.90.60 for semiconductor slicing equipment removing material.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Document wire count (200+) and kerf width (<50 microns) characteristics

• Consider drawback programs for export re-import scenarios