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8461.90.60/Gallium Arsenide Wafer Slicer/Japan

Gallium Arsenide Wafer Slicer from Japan

Specialized saw for slicing compound semiconductor (GaAs) boules into wafers, using fine kerf wire saw technology. Covered by HTS 8461.90.60 statistical note for semiconductor wafer manufacturing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Reference statistical note coverage of gallium arsenide explicitly

• Validate wire specification for multi-wire saw classification

Gallium Arsenide Wafer Slicer from Japan — Import Duty Rate | HTS 8461.90.60