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Gallium Arsenide Wafer Slicer from Germany

Specialized saw for slicing compound semiconductor (GaAs) boules into wafers, using fine kerf wire saw technology. Covered by HTS 8461.90.60 statistical note for semiconductor wafer manufacturing equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Import Tips

Reference statistical note coverage of gallium arsenide explicitly

Validate wire specification for multi-wire saw classification

Gallium Arsenide Wafer Slicer from Germany — Import Duty Rate | HTS 8461.90.60