Gallium Arsenide Wafer Slicer from Germany
Specialized saw for slicing compound semiconductor (GaAs) boules into wafers, using fine kerf wire saw technology. Covered by HTS 8461.90.60 statistical note for semiconductor wafer manufacturing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical note coverage of gallium arsenide explicitly
• Validate wire specification for multi-wire saw classification