Epitaxy Wafer Preparation Polisher from Mexico
Final polish station creating ultra-flat wafer surfaces (<0.5 micron total thickness variation) for epitaxial layer growth. HTS 8461.90.60 classification for CMP-type wafer polishers in semiconductor manufacturing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide TTV (total thickness variation) specs proving semiconductor tolerance
• Seek binding ruling for single vs double-side polishers