8461.90.60/Epitaxy Wafer Preparation Polisher/Japan

Epitaxy Wafer Preparation Polisher from Japan

Final polish station creating ultra-flat wafer surfaces (<0.5 micron total thickness variation) for epitaxial layer growth. HTS 8461.90.60 classification for CMP-type wafer polishers in semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide TTV (total thickness variation) specs proving semiconductor tolerance

• Seek binding ruling for single vs double-side polishers