8461.90.60/Epitaxy Wafer Preparation Polisher/Germany

Epitaxy Wafer Preparation Polisher from Germany

Final polish station creating ultra-flat wafer surfaces (<0.5 micron total thickness variation) for epitaxial layer growth. HTS 8461.90.60 classification for CMP-type wafer polishers in semiconductor manufacturing.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide TTV (total thickness variation) specs proving semiconductor tolerance

• Seek binding ruling for single vs double-side polishers