8461.90.60/Epitaxy Wafer Preparation Polisher/Germany

Epitaxy Wafer Preparation Polisher from Germany

Final polish station creating ultra-flat wafer surfaces (<0.5 micron total thickness variation) for epitaxial layer growth. HTS 8461.90.60 classification for CMP-type wafer polishers in semiconductor manufacturing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Provide TTV (total thickness variation) specs proving semiconductor tolerance

• Seek binding ruling for single vs double-side polishers