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8461.90.60/Diamond Wafer Polishing Machine/Mexico

Diamond Wafer Polishing Machine from Mexico

Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify diamond grit size and pressure specs for classification

• Classify polishing pads separately under 6804.21

Diamond Wafer Polishing Machine from Mexico — Import Duty Rate | HTS 8461.90.60