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8461.90.60/Diamond Wafer Polishing Machine/Japan

Diamond Wafer Polishing Machine from Japan

Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify diamond grit size and pressure specs for classification

• Classify polishing pads separately under 6804.21

Diamond Wafer Polishing Machine from Japan — Import Duty Rate | HTS 8461.90.60