8461.90.60/Diamond Wafer Polishing Machine/Germany

Diamond Wafer Polishing Machine from Germany

Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify diamond grit size and pressure specs for classification

• Classify polishing pads separately under 6804.21

Diamond Wafer Polishing Machine from Germany — Import Duty Rate | HTS 8461.90.60