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8461.90.60/Diamond Wafer Polishing Machine/Canada

Diamond Wafer Polishing Machine from Canada

Uses diamond slurry and pads to polish semiconductor wafers to mirror finish required for lithography. Mechanical polishing action removes cermet, placing it under HTS 8461.90.60 statistical note (a)(ii)(C).

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify diamond grit size and pressure specs for classification

• Classify polishing pads separately under 6804.21