Crystal Boule Grinder from Japan

Precision grinder that shapes silicon crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. As wafer preparation equipment removing cermet material, it is classified in HTS 8461.90.60 under other machine tools for semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit boule diameter tolerance specs to confirm classification under statistical note (a)(ii)(A)

• Use HTS advisory rulings for hybrid grinders to avoid disputes