Wafer Edge Grinder from Japan

Machine that grinds wafer edges to prevent chipping and achieve precise roundness for subsequent fabrication steps. Classified HTS 8461.90.60.90 as specialized shaping tool removing minimal semiconductor material.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Provide edge chipping reduction specs (e.g

• <1μm) to distinguish from general grinders

• Include compatibility certification for silicon, GaAs, and SiC wafers