Wafer Edge Grinder from Germany
Machine that grinds wafer edges to prevent chipping and achieve precise roundness for subsequent fabrication steps. Classified HTS 8461.90.60.90 as specialized shaping tool removing minimal semiconductor material.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide edge chipping reduction specs (e.g
• <1μm) to distinguish from general grinders
• Include compatibility certification for silicon, GaAs, and SiC wafers