Wafer Edge Grinder from Germany
Machine that grinds wafer edges to prevent chipping and achieve precise roundness for subsequent fabrication steps. Classified HTS 8461.90.60.90 as specialized shaping tool removing minimal semiconductor material.
Duty Rate — Germany → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide edge chipping reduction specs (e.g
• <1μm) to distinguish from general grinders
• Include compatibility certification for silicon, GaAs, and SiC wafers