Wafer Edge Grinder from Canada
Machine that grinds wafer edges to prevent chipping and achieve precise roundness for subsequent fabrication steps. Classified HTS 8461.90.60.90 as specialized shaping tool removing minimal semiconductor material.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide edge chipping reduction specs (e.g
• <1μm) to distinguish from general grinders
• Include compatibility certification for silicon, GaAs, and SiC wafers