8461.90.60.90/Silicon Wafer Polisher/Japan

Silicon Wafer Polisher from Japan

Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify removal rates and surface roughness (Ra <0.2nm) for classification

• Cleanroom compatibility (ISO Class 1) documentation required

• Avoid generic polishing descriptions risking 8460 reclassification

Silicon Wafer Polisher from Japan — Import Duty Rate | HTS 8461.90.60.90