8461.90.60.90/Silicon Wafer Polisher/Japan

Silicon Wafer Polisher from Japan

Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify removal rates and surface roughness (Ra <0.2nm) for classification

• Cleanroom compatibility (ISO Class 1) documentation required

• Avoid generic polishing descriptions risking 8460 reclassification