Silicon Wafer Polisher from Germany
Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify removal rates and surface roughness (Ra <0.2nm) for classification
• Cleanroom compatibility (ISO Class 1) documentation required
• Avoid generic polishing descriptions risking 8460 reclassification