Silicon Wafer Polisher from Canada
Double-sided polishing machine bringing semiconductor wafers to final thickness and mirror finish before device fabrication. Falls under HTS 8461.90.60.90 as other machine tool for cermet surface finishing.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify removal rates and surface roughness (Ra <0.2nm) for classification
• Cleanroom compatibility (ISO Class 1) documentation required
• Avoid generic polishing descriptions risking 8460 reclassification