SiC Wafer Lapper from Mexico
Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Hardness specs (Mohs 9.5) and diamond grit size documentation required
• High-pressure slurry system details for SiC classification