SiC Wafer Lapper from Japan
Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Hardness specs (Mohs 9.5) and diamond grit size documentation required
• High-pressure slurry system details for SiC classification