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8461.90.60.90/SiC Wafer Lapper/Japan

SiC Wafer Lapper from Japan

Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Hardness specs (Mohs 9.5) and diamond grit size documentation required

• High-pressure slurry system details for SiC classification

SiC Wafer Lapper from Japan — Import Duty Rate | HTS 8461.90.60.90