SiC Wafer Lapper from Germany
Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Hardness specs (Mohs 9.5) and diamond grit size documentation required
• High-pressure slurry system details for SiC classification