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SiC Wafer Lapper from Germany

Lapping system for hard silicon carbide wafers using diamond abrasives to achieve extreme flatness for power electronics. HTS 8461.90.60.90 as other machine tool for difficult cermets.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Import Tips

Hardness specs (Mohs 9.5) and diamond grit size documentation required

High-pressure slurry system details for SiC classification

SiC Wafer Lapper from Germany — Import Duty Rate | HTS 8461.90.60.90