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8461.90.60.90/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

Diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8461.90.60.90 covers this as other sawing machine tools for precise cermet material removal in semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify wire diameter and tension specs matching statistical note wafer slicing requirements

• Include TTV (total thickness variation) performance data for classification support

Semiconductor Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8461.90.60.90