8461.90.60.90/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

Diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8461.90.60.90 covers this as other sawing machine tools for precise cermet material removal in semiconductor processing.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify wire diameter and tension specs matching statistical note wafer slicing requirements

• Include TTV (total thickness variation) performance data for classification support

Semiconductor Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8461.90.60.90