Semiconductor Wafer Slicing Saw from Germany
Diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8461.90.60.90 covers this as other sawing machine tools for precise cermet material removal in semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter and tension specs matching statistical note wafer slicing requirements
• Include TTV (total thickness variation) performance data for classification support