Semiconductor Wafer Slicing Saw from Canada
Diamond wire or blade saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. HTS 8461.90.60.90 covers this as other sawing machine tools for precise cermet material removal in semiconductor processing.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify wire diameter and tension specs matching statistical note wafer slicing requirements
• Include TTV (total thickness variation) performance data for classification support