Large Diameter Ingot Trimmer from Japan
Heavy-duty trim saw/grinder for 450mm+ semiconductor ingots preparing for next-gen wafer production. HTS 8461.90.60.90 other large-scale cermet working tools.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Ingot size capacity (450-510mm) and weight handling specs required
• Transition roller and alignment system documentation
• Risk of general machinery classification without diameter specs