Diamond Wire Wafer Saw from Mexico
Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon boules. HTS 8461.90.60.90 other high-precision sawing for semiconductors.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Wire diameter (50-100μm) and slicing speed specs mandatory
• Slurry recirculation system documentation for classification