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8461.90.60.90/Diamond Wire Wafer Saw/Japan

Diamond Wire Wafer Saw from Japan

Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon boules. HTS 8461.90.60.90 other high-precision sawing for semiconductors.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Wire diameter (50-100μm) and slicing speed specs mandatory

• Slurry recirculation system documentation for classification

Diamond Wire Wafer Saw from Japan — Import Duty Rate | HTS 8461.90.60.90