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8461.90.60.90/Diamond Wire Wafer Saw/Canada

Diamond Wire Wafer Saw from Canada

Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of wafers from silicon boules. HTS 8461.90.60.90 other high-precision sawing for semiconductors.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Wire diameter (50-100μm) and slicing speed specs mandatory

• Slurry recirculation system documentation for classification

Diamond Wire Wafer Saw from Canada — Import Duty Rate | HTS 8461.90.60.90