8461.90.60.90/Crystal Ingot Lapping Machine/Japan

Crystal Ingot Lapping Machine from Japan

Lapping equipment that achieves flatness on crystal ingots prior to slicing, using diamond slurries for sub-micron surface finish. HTS 8461.90.60.90 as other finishing machine tool for semiconductor boule preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document slurry composition and flatness specs (<0.5μm across boule)

• Include vibration isolation specs critical for ingot stability