Crystal Ingot Lapping Machine from Japan
Lapping equipment that achieves flatness on crystal ingots prior to slicing, using diamond slurries for sub-micron surface finish. HTS 8461.90.60.90 as other finishing machine tool for semiconductor boule preparation.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document slurry composition and flatness specs (<0.5μm across boule)
• Include vibration isolation specs critical for ingot stability