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8461.90.60.90/Compound Semiconductor Profile Grinder/Japan

Compound Semiconductor Profile Grinder from Japan

Grinder for creating specific flat orientations on GaN, InP boules for LED/photonics applications with crystal orientation accuracy. HTS 8461.90.60.90 other precision shaping.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• X-ray diffraction specs for orientation accuracy (±0.1°)

• Compound material hardness and thermal specs documentation

Compound Semiconductor Profile Grinder from Japan — Import Duty Rate | HTS 8461.90.60.90