Compound Semiconductor Profile Grinder from Japan
Grinder for creating specific flat orientations on GaN, InP boules for LED/photonics applications with crystal orientation accuracy. HTS 8461.90.60.90 other precision shaping.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• X-ray diffraction specs for orientation accuracy (±0.1°)
• Compound material hardness and thermal specs documentation