8461.90.60.90/Automated Wafer Backlapper/Mexico

Automated Wafer Backlapper from Mexico

Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Bow/warp specs (<10μm) and real-time metrology integration details

• Carrier compatibility for 200mm/300mm wafers required

• Risk of 8421 classification without semiconductor specs

Automated Wafer Backlapper from Mexico — Import Duty Rate | HTS 8461.90.60.90