8461.90.60.90/Automated Wafer Backlapper/Japan

Automated Wafer Backlapper from Japan

Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Bow/warp specs (<10μm) and real-time metrology integration details

• Carrier compatibility for 200mm/300mm wafers required

• Risk of 8421 classification without semiconductor specs