Automated Wafer Backlapper from Japan
Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Bow/warp specs (<10μm) and real-time metrology integration details
• Carrier compatibility for 200mm/300mm wafers required
• Risk of 8421 classification without semiconductor specs