Automated Wafer Backlapper from Japan
Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Bow/warp specs (<10μm) and real-time metrology integration details
• Carrier compatibility for 200mm/300mm wafers required
• Risk of 8421 classification without semiconductor specs