8461.90.60.90/Automated Wafer Backlapper/Germany

Automated Wafer Backlapper from Germany

Robotic backlapping system for uniform wafer thinning with in-situ thickness measurement maintaining bow/warp specs. Classified HTS 8461.90.60.90 specialized semiconductor finishing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Bow/warp specs (<10μm) and real-time metrology integration details

• Carrier compatibility for 200mm/300mm wafers required

• Risk of 8421 classification without semiconductor specs