8461.90.60.50/Entry-Level Wafer Lapping Machine/Mexico

Entry-Level Wafer Lapping Machine from Mexico

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) to prove wafer processing use

• Ensure slurry system compatibility docs for customs review

• Classify lapping pads separately if imported as accessories