8461.90.60.50/Entry-Level Wafer Lapping Machine/Japan

Entry-Level Wafer Lapping Machine from Japan

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) to prove wafer processing use

• Ensure slurry system compatibility docs for customs review

• Classify lapping pads separately if imported as accessories