8461.90.60.50/Entry-Level Wafer Lapping Machine/Germany

Entry-Level Wafer Lapping Machine from Germany

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) to prove wafer processing use

• Ensure slurry system compatibility docs for customs review

• Classify lapping pads separately if imported as accessories