Entry-Level Wafer Lapping Machine from Germany
Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include flatness tolerance specs (e.g
• <1 micron) to prove wafer processing use
• Ensure slurry system compatibility docs for customs review
• Classify lapping pads separately if imported as accessories