Entry-Level Wafer Lapping Machine from Germany
Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness tolerance specs (e.g
• <1 micron) to prove wafer processing use
• Ensure slurry system compatibility docs for customs review
• Classify lapping pads separately if imported as accessories