8461.90.60.50/Entry-Level Wafer Lapping Machine/China

Entry-Level Wafer Lapping Machine from China

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Duty Rate — China → United States

41.9%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) to prove wafer processing use

• Ensure slurry system compatibility docs for customs review

• Classify lapping pads separately if imported as accessories