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8461.90.60.50/Entry-Level Wafer Lapping Machine/Canada

Entry-Level Wafer Lapping Machine from Canada

Basic lapping tool for flattening semiconductor wafers to tight tolerances by material removal. Under HTS 8461.90.60.50 as low-value wafer prep equipment per statistical notes.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) to prove wafer processing use

• Ensure slurry system compatibility docs for customs review

• Classify lapping pads separately if imported as accessories

Entry-Level Wafer Lapping Machine from Canada — Import Duty Rate | HTS 8461.90.60.50