Used Wafer Edge Grinder from Mexico
Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify bevel angle and edge geometry capabilities in import docs
• Test for particle generation meeting cleanroom standards
• Avoid declaring as general lapidary equipment