8461.90.60.40/Used Wafer Edge Grinder/Japan

Used Wafer Edge Grinder from Japan

Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify bevel angle and edge geometry capabilities in import docs

• Test for particle generation meeting cleanroom standards

• Avoid declaring as general lapidary equipment