Used Wafer Edge Grinder from Japan
Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify bevel angle and edge geometry capabilities in import docs
• Test for particle generation meeting cleanroom standards
• Avoid declaring as general lapidary equipment