Used Wafer Edge Grinder from Germany
Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify bevel angle and edge geometry capabilities in import docs
• Test for particle generation meeting cleanroom standards
• Avoid declaring as general lapidary equipment