8461.90.60.40/Used Wafer Edge Grinder/China

Used Wafer Edge Grinder from China

Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Specify bevel angle and edge geometry capabilities in import docs

• Test for particle generation meeting cleanroom standards

• Avoid declaring as general lapidary equipment

Used Wafer Edge Grinder from China — Import Duty Rate | HTS 8461.90.60.40