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Used Wafer Edge Grinder from Canada

Rebuilt grinder for profiling wafer edges to prevent chipping during handling and processing. HTS 8461.90.60.40 for used machine tools removing material from semiconductor wafers.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada

Import Tips

Specify bevel angle and edge geometry capabilities in import docs

Test for particle generation meeting cleanroom standards

Avoid declaring as general lapidary equipment