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Used boule Diameter Grinder from Japan

Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

Import Tips

• Specify diameter tolerance (e.g

• ±0.1mm) documentation

• Include crystal orientation flat grinding capability

• Verify vibration isolation for boule integrity