8461.90.60.40/Used boule Diameter Grinder/Japan

Used boule Diameter Grinder from Japan

Reconditioned grinder maintaining cylindrical precision on semiconductor crystal boules. HTS 8461.90.60.40 for used metal-removal in wafer manufacturing per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify diameter tolerance (e.g

• ±0.1mm) documentation

• Include crystal orientation flat grinding capability

• Verify vibration isolation for boule integrity