Wafer Surface Planer for Float Zone Silicon from Japan
Precision planer specifically engineered for float zone silicon wafers, removing material to achieve mirror-flat surfaces prior to fabrication. HTS 8461.90.60.30 classification applies due to its planing action on cermet-like semiconductor materials as defined in Chapter 84 statistical notes for wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document compatibility with float zone crystal methods to align with statistical note (a)(i) crystal growers & pullers processing
• Ensure import declaration specifies 'planing machines' not 'lapping/polishing' to maintain correct subheading
• Avoid pitfall of classifying with polishing equipment (different HTS) by emphasizing initial planing step